<p>The surface of a molded article of a fluorine resin is treated to provide better adhesion by sputter etching it in an atmosphere whose pressure is maintained at about 0.0005 to about 0.5 Torr.</p>
申请公布号
DE2616466(C2)
申请公布日期
1989.02.02
申请号
DE19762616466
申请日期
1976.04.14
申请人
NITTO ELECTRIC INDUSTRIAL CO., LTD., IBARAKI, OSAKA, JP
