发明名称 |
MULTILAYERED CIRCUIT BOARD CONNECTING INTEGRATING CIRCUIT TO TERMINATION CIRCUIT. |
摘要 |
A wiring structure for a termination circuit in which a termination circuit is connected to an integrated circuit through a fixed wiring pattern provided in a leadout layer closest to the mounting surface. |
申请公布号 |
AU580828(B2) |
申请公布日期 |
1989.02.02 |
申请号 |
AU19860051938 |
申请日期 |
1985.11.28 |
申请人 |
FUJITSU LIMITED |
发明人 |
MIKIO NISHIHARA;KIYOSHI KUWABARA |
分类号 |
H05K1/02;H01L23/538;H05K1/11;H05K3/46;(IPC1-7):H05K1/02;H01L27/13;H01L23/48 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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