| 摘要 |
In this method, a thin metal foil (5), e.g. a gold foil, is positioned directly in front of a substrate (6), e.g. a copper support, to be coated. By means of a pulsed laser beam (4) focused via a lens system (3), metal is transferred from this metal foil (5) locally onto the substrate (6). In this way, microregions of components, connectors or printed circuit boards can be provided with local gold contacts. By using special optical image and diaphragm systems (8), it is also possible in the focusing range, to effect instead of a surface coating a structuring of the substrate (6) with metal in order to build up internal structures of microchips. An Nd-YAG laser (1) operating in the UV range is preferably used. <IMAGE> |
