发明名称 FORMING METHOD FOR SILICON THIN FILM FOR THIN FILM TRANSISTOR
摘要 PURPOSE:To obtain a silicon thin film transistor having a high carrier mobility and capable of controlling a threshold voltage to a low value by discharging in inert gas added with hydrogen gas of specific molar % to generate ions, colliding them to the surface of a target to deposit discharged silicon atoms on a substrate, and annealing it for a specific length of time. CONSTITUTION:One or more of inert gases, such as helium, neon, argon, xenon, krypton and the like are mixed, and 1-50mol% of hydrogen gas is further mixed as sputtering gas. When a negative DC voltage or high frequency voltage is applied to an electrode 22, a glow discharge is generated to generate ions from the inert atmospheric gas to collide with the surface of a target 23 made of silicon. As a result, the silicon atoms are expelled out from the target 23 to form a silicon thin film on an insulating substrate 26. Then, the silicon thin film is annealed for a short time, such as 10 sec or less of heating time by a light radiating method of a laser to form a polycrystalline state.
申请公布号 JPS6431466(A) 申请公布日期 1989.02.01
申请号 JP19870187345 申请日期 1987.07.27
申请人 NIPPON TELEGR & TELEPH CORP <NTT> 发明人 SERIKAWA TADASHI;SHIRAI SEIICHI;OKAMOTO AKIO;SUYAMA SHIRO
分类号 H01L21/20;H01L21/336;H01L27/12;H01L29/78;H01L29/786 主分类号 H01L21/20
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