| 摘要 |
PURPOSE:To manufacture the title structure at a low cost and easily and to realize a large-sized structure by a method wherein a transparent electrode having a prescribed circuit pattern is formed on a glass substrate, an Ni-P layer of high phosphorus concentration and an Ni-P layer of low phosphorus concentration which have a pattern of a drive circuit, an extraction electrode or the like are formed on the transparent electrode and, furthermore, an Au layer is formed on the layer. CONSTITUTION:A transparent electrode 13 by an ITO film having various patterns is formed on a glass substrate 11; this transparent electrode 13 is patterned to a prescribed circuit pattern; in succession, an Ni-P layer of high phosphorus concentration, e.g. about 10%, and an Ni-P layer 15 of low phosphorus concentration, e.g. about 1%, are formed selectively on the pattern of the transparent electrode 13 by a non-electrolytic plating method. Then, an Au layer 16 is formed on the Ni-P layer 15 by a substitution reaction. By this setup, a three-layer metallized structure is formed on the transparent electrode 13. As a result, it is possible to obtain a substrate for chip-on glass mounting use at a low cost and with the excellent productivity. |
