发明名称 WIRE BONDING DEVICE
摘要 PURPOSE:To prevent a clogging due to foreign substances in the interior of an inserting hole and to make possible the connection between electrodes using highly reliable wires by a method wherein a wire bonding device is made to be provided with a forced evacuating means in the interior of the inserting hole for the conductive wires of a bonding tool. CONSTITUTION:A forced evacuating means 20 is provided on the side of a capillary main body 13a and by feeding a high-pressure fluid 21 into an insertion hole 14 in the interior of the main body 13a, foreign substances D left by adhering in the interior of the hole 14 are eliminated forcibly from the interior of a capillary 13. Thereby, a clogging due to the foreign substances in the interior of the capillary 13 is prevented. Moreover, pressure feeding holes 23, through which the means 20 and the hole 14 are interconnected to each other, are opened from the direction oblique to the side parts in such a way that the fluid 21 is circulated in the direction reverse to the lead-out direction of wires 18 along the inner wall surface of the hole 14. Accordingly, the foreign substances D left by adhering in the interior of the hole 14 are never eliminated in the direction of a pellet 3 when being eliminated forcibly by a fluid pressure.
申请公布号 JPS6428834(A) 申请公布日期 1989.01.31
申请号 JP19870183297 申请日期 1987.07.24
申请人 HITACHI LTD 发明人 TANIMOTO MICHIO;OKIKAWA SUSUMU;SUZUKI HIROMICHI
分类号 H01L21/60 主分类号 H01L21/60
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