Resist coating apparatus

摘要

A liquid state resist is dropped to form a coating on a semiconductor substrate mounted on a rotary chuck disposed in a resist coating vessel in which a sealed solvent vapor atmosphere is created. An adjusting plate is provided in the coating vessel above the rotary chuck in a stationary or movable manner to weaken or substantially reduce a swirly flow of the solvent vapor which tends to occur in the coating vessel when the chuck is rotated. Thus a substrate coated with a resist film of uniform thickness is obtained.