发明名称 DEVICE FOR HEAT CONNECTING TREATMENT AND ITS PROCESS
摘要 PURPOSE:To reduce the cost of production by improving its productivity, while the relative spacing and the parallel degree of a base plate and an olifice plate are more precisely controlled by applying pressurized fluid to the base, a heat source and the flexible sheet arranged on the assembly on the base. CONSTITUTION:A heat connecting device 110 is provided with a frame 112, a base 114 and a ram 116. The ram 116 is provided with a chamber 118 and an air port 320 for feeding gas material into the chamber 118 or evacuating the chamber 18. An O ring shape-seal 342 scals the chamber 118 with a flexible sheet 132. An assembly is compressed and heated simultaneously, and heat connection is achieved. The heat is fed by the heating element 338 buried in the flexible sheet 132, and the compression is given by feeding pressurized air or nitrogen into the chamber 118 from the air port 320.
申请公布号 JPS6426445(A) 申请公布日期 1989.01.27
申请号 JP19880159021 申请日期 1988.06.27
申请人 YOKOGAWA HEWLETT PACKARD LTD 发明人 UIRIAMU JIYON UESUTO;HAWAADO HAIMAN TAUBU;ROBAATO JIEE MIRAA
分类号 B32B37/10;B29C65/00;B29C65/30;B29C65/50;B29C65/78;B32B43/00;B41J2/05;B41J2/16 主分类号 B32B37/10
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