Method of producing electrical connections between sides of printed-circuit boards withstanding thermal stresses, in particular three-board circuits

摘要

In order to ensure an earth connection between an upper circuit 4 of a three-board assembly 2, 3 and a lower earth plane 6, which connection withstands the thermal stresses, thick-walled rivets 8, 9 are formed by electrolytic deposition. Application: UHF circuits. <IMAGE>