| 摘要 |
<p>PURPOSE:To improve optical coupling efficiency and reliability for an optical coupling device, by forming a light-receiving device in one semiconductor layer and forming a photodetector in the other semiconductor layer and making the one semiconductor layer face the other semiconductor layer and next by sticking these semiconductor layers to each other with a light transmissive transparent medium in between. CONSTITUTION:A photodetector is formed in an upper semiconductor layer 1, and a light-emitting device is formed in a lower semiconductor layer 14. The upper plane of the lower semiconductor layer 14 is first coated with a transparent medium 21. This transparent medium 21 is made of epoxy resin, acrylic resin, or the like, and it serves as a layer for sticking the upper semiconductor layer 1 and the lower semiconductor layer 14. The upper semiconductor layer 1 is turned upside down and piled on the lower semiconductor layer 14 and they are stuck to each other. A sticking process of the upper semiconductor layer 1 and the lower semiconductor layer 14 is performed in such a way that they are fixed on a position where a p-type diffusion layer 2 is made to face a p-type diffusion layer 16 and the transparent medium 21 is hardened at a prescribed temperature. Scribing lines 12 and 17 are positioned to face each other by such a sticking process.</p> |
