| 摘要 |
PURPOSE:To improve a substrate of this design in an adhesive and heat resistant property by a method wherein a hardening resin composition, which is composed of a polyphenylene ether resin used as an integral component, is used for the adhesion of alloy consisting of a main component such as Fe and Ni. CONSTITUTION:An IC chip mounting substrate is provided which is formed in such a manner as an alloy 9X10<-6>cm/cm/ deg.C in a linear expansion coefficient consisting of main components such as iron and nickel is laminated and adhered to a metallic foil, a metallic foil-plated insulating plate, or a printed wiring plate, where a hardening resin composition consisting of an integral component of polyphenylene ether resin is used as a laminar adhesive resin composition. Further, an alloy 9X10<-6>cm/cm/ deg.C in linear expansion coefficient consisting of iron and nickel used as integral components is such an alloy as an invar alloy and an elinvar type alloy to which a small amount of Cr, Co, and Mn is added as an optional sub-component. And, an epoxy resin, a thermosetting polyidde resin, an isocyanate resin, a diallyl phthalate resin, or a cyanate is added to a polypheylene ether resin for the formation of a hardening resin composition. |
