| 摘要 |
<p>PURPOSE:To form a solder layer of a thickness with good accuracy and to prevent a breakdown of a device and deterioration of electric characteristics by a method wherein a series of soldering operations to mount semiconductor elements on an upper part of individual semiconductor soldering parts separated by a separation zone in a state that a solder material is melted is executed one by one. CONSTITUTION:In a die pad part 2a as a flat part on a metal frame 2 where two or more semiconductor elements 1 are to be soldered in parallel, V-shaped grooves 10 are formed as separation zones to separate each semiconductor element 1 at each soldering part. A series of soldering operations to mount solders 3, to melt the solders and to solder the semiconductor elements 1 is executed separately and continuously at individual semiconductor element soldering parts 11 of the die pad parts 2a on the frame 2 separated by the V-shaped grooves 10. If the semiconductor elements 1 are mounted in the individual soldering parts 11, the solders squeezed toward the center can be prevented from being expanded due to the V-shaped grooves 10. An amount of the solders at the individual soldering parts can be controlled appropriately and surely; a soldering operation can be executed in a surely molten-bonded state; accordingly, the reliability and the stability can be enhanced.</p> |
