| 摘要 |
The contact arrangement comprises a semiconductor wafer 1 having on one of its major faces 9 an area 4 of one type of conductivity and an electrical contact 11 in face-to-face engagement with that area, in which the contact is located with respect to that area and is secured to the wafer by a stud 15 welded to the wafer and projecting into a hole 14 extending through the contact. The stud may comprise an aluminium ball which is deformed by welding to secure the contact to the wafer. To prevent a preferential electrical path through the weld, the stud may be surrounded by an insulating sleeve. <IMAGE> |
