Semiconductor device package structure.

摘要

A semiconductor device package (15) comprising a package wall (17) through which the accurate position of the semiconductor device (1) having a semiconductor element on one of its major surfaces is to be determined. The package wall (17) has apertures (21) for allowing the corners (14) of the semiconductor device to be exposed therethrough, thereby allowing the accurate position of the semiconductor device to be determined. The package wall has an exposure window (6) through which a substantial central portion of the other of its major surfaces is exposed, and the semiconductor device (1) is attached at the periphery of the other of its major surfaces to an edge of the exposure window.