发明名称 |
SOLDER JOINT BETWEEN AN ELECTRICAL COMPONENT AND A SUBSTRATE |
摘要 |
<p>A power component such as a power transistor is mounted on an insulating substrate of e.g. Beryllia. By using a thick film deposition technique. A first layer (2) is deposited and a second layer (3) is deposited over the first layer to produce a regular series of troughs and lans, in the preferred embodiment troughs and ridges, whereby voiding in the solder bond is minimised if not eliminated to thus maintain a good thermal conductivity between the component and the substrate.</p> |
申请公布号 |
EP0259035(A3) |
申请公布日期 |
1989.01.25 |
申请号 |
EP19870307154 |
申请日期 |
1987.08.13 |
申请人 |
STC PLC |
发明人 |
GAINEY, TREVOR CLIFFORD;HALL, IAN;JONES, ALAN ROBERT |
分类号 |
H01L21/58;H01L21/60;H05K1/09;H05K1/11;H05K3/24;H05K3/34;(IPC1-7):H01L21/60 |
主分类号 |
H01L21/58 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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