发明名称 METHOD AND SYSTEM FOR MULTI-LAYER PRINTED CIRCUIT BOARD PRE-DRILL PROCESSING
摘要 <p>A method and apparatus for optimizing the drilling position of a multi-layer printed circuit board prior to drilling. A template (115) having precisely located target holes (A',B',C',D') and fixture reference marks (118, 119) provides initial coordinate reference information for multi-layer printed circuit boards (25) to be inspected by x radiation. Each board (25) is processed by insertion into a holding fixture, examination of four quadrant target areas using x-ray sources (21-24) and detectors (26-29), digitization of the target area images in each quadrant, and computation of the optimum board position in a follow-on drilling apparatus. After optimization, three reference holes are punched along one edge of the board (25) to provide accurate fiducial positioning marks when the board is placed in the drilling apparatus.</p>
申请公布号 EP0264243(A3) 申请公布日期 1989.01.25
申请号 EP19870308979 申请日期 1987.10.09
申请人 LOMA PARK ASSOCIATES INC. 发明人 WILENT, JOHN W.;BENSON, ROBERT F.;SPARKS, ROBERT A.
分类号 B23B49/00;H05K3/00;H05K3/46;(IPC1-7):H05K13/00;G03F9/00 主分类号 B23B49/00
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