A remover solution for photoresist.

摘要

The inventive remover solution for photoresist compositions comprises (a) a solvent which is typically water, (b) an inorganic or organic alkaline compound such as sodium and potassium hydroxides, and (c) a borohydride compound such as sodium and lithium borohydrides and organic amine borane compounds. When used for removing patter-wise photoresist layer in the manufacturing process of, for example, electronic circuit board substrates, the inventive remover solution gives quite satisfactory results without discoloration or denaturation of the copper surface and solder surface consequently leading to the production of high-quality products.