METHOD OF MAKING PRINTED CIRCUIT BOARDS HAVING IMPROVED ADHESION BETWEEN SOLDER MASK AND METAL

摘要

A method for making a printed circuit board which includes a u.v. curable solder mask coating over a substrate including a metal, comprising a step which improves the adhesion between mask and metal by applying a primer film to said substrate from an aqueous solution which includes 0.01 to 10 % by weight of a carboxyl-containing polymer or copolymer.