Integrated circuit with improved monitoring function by use of built-in elements

摘要

A semiconductor integrated circuit of the type having at least one reference element fabricated on a semiconductor chip on which functional elements are formed is obtained by a high integration structure. The reference element is coupled through a switching element to a bonding pad to which a part of the functional elements is connected. The switching element assumes a non-conductive state when the functional elements operate and a conductive state when a voltage applied thereto is outside the normal operating voltage of the functional elements.