发明名称 |
METHOD FOR SELECTIVELY GROWING THIN METALLIC FILM |
摘要 |
PURPOSE:To selectively grow a thin tungsten film on a specified part on a substrate by keeping the substrate at a prescribed low temp. until a specified base exposed surface is covered with a tungsten film during film formation. CONSTITUTION:When selective vapor growth of a tungsten film is carried out with gaseous tungsten halide and H2 as starting materials, a substrate is kept at a low temp. of <=250 deg.C in the early stage of film formation and a tungsten film is grown until at least the base exposed surface is covered with the film in the early stage. The substrate is then heated to a temp. at which a film is formed at a high rate and film formation is continued until a prescribed film thickness is obtd. Thus, selective vapor growth of a tungsten film is carried out only on a specified base on the substrate. |
申请公布号 |
JPS6421074(A) |
申请公布日期 |
1989.01.24 |
申请号 |
JP19870176987 |
申请日期 |
1987.07.17 |
申请人 |
HITACHI LTD |
发明人 |
NISHITANI EISUKE;TSUJIKU SUSUMU;NAKATANI MITSUO;MAEHARA MASAAKI;HORIUCHI MITSUAKI;MIZUKAMI KOICHIRO |
分类号 |
C23C16/44;C23C16/04;C23C16/06 |
主分类号 |
C23C16/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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