发明名称 RESIST COATING DEVICE
摘要 PURPOSE:To remove a resist elongated in a thread state and to obtain a resist film having uniform thickness by surrounding the periphery of a check for holding a semiconductor substrate connected to a rotary power with rod-like material in a resist coating device having the chuck in a cup. CONSTITUTION:The output shaft of a motor 8 is penetrated at the center of the bottom of a cup 3 provided with a pipe 5 and a duct 6 for recovering resist liquid in the bottom, a chuck 2 is horizontally mounted at the upper end, and a semiconductor substrate 1 to be coated with the liquid is bonded thereon. When an openable cup base 4 for mounting the substrate 1 is provided in the upper opening of the cup 3, a nozzle 7 for dropping the liquid is provided at the center of the cover 4, and a plurality of rod-like materials 9 enclosing the substrate 1 on the chuck 2 from the lower surface of the cover 4 and extended at its end to the lower side of the substrate 1 are inserted. Thus, the thread-like resist liquid to be scattered by a centrifugal force is disturbed by the materials 9 and not adhered to the surface of the substrate 1.
申请公布号 JPS6420620(A) 申请公布日期 1989.01.24
申请号 JP19870177611 申请日期 1987.07.15
申请人 NEC CORP 发明人 TANAKA TSUYOSHI
分类号 G03F7/20;B05C11/08;G03F7/16;H01L21/027;H01L21/30;H01L21/68;H01L21/683 主分类号 G03F7/20
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