| 摘要 |
PURPOSE:To uniform the sheet thickness at the time of slicing, shorten the grinding time and reduces the raw material cost by adsorption supporting a semi-conductor wafer to an adsorption material with a reference surface in parallel with a cutting blade. CONSTITUTION:A supporting component 15 connected with a positioning mechanism in a manner to move up, down and horizontally is disposed on the central upper section of a housing 12. A pillar-shaped adsorption component 16 constituted of carbon is fixed on the lower face of the supporting component 15. A wafer 20 and the like are adsorbed and supported on a refence surface 16a of the adsorption component 16 by the suction of a suction device, and moved up and down by an index mechanism to register the thickness of cut sheet. At the time of cutting, the wafer 20 is sliced while the wafer 20 is moved horizontally by the index mechanism in the state that an inner peripheral blade 14 is rotated by revolving a revolving shaft 11, and the wafer 20 of desired thickness is formed with the inner peripheral blade 14. As the lower face of the adsorption component 16 is formed as a reference surface, registering of the index mechanism is easy at the time of cutting and the sheet thickness of the wafer can be sliced uniformly, and the processing cost of grinding process can be reduced. |
