发明名称 MIS STRUCTURE PHOTOSENSOR
摘要 <p>PURPOSE:To facilitate application of a photosensor under severe conditions by a method wherein an insulating layer and a metal layer are successively built up on a semiconductor layer and the insulating layer is made of photoconductive material. CONSTITUTION:An insulating layer 3 and a metal layer 4 are successively built up on a semiconductor layer 2 and the insulating layer 3 is made of photoconductive material. For instance, a MIS structure is formed by building up the photoconductive amorphous SiC layer 3 on the single crystal SiC layer 2 to provide the function of a photosensor. With this constitution, a photosensor which can be used under the conditions under which a conventional photosensor using Si and the like can not be used can be manufactured and, further, the application range of SiC semiconductor to devices can be widened.</p>
申请公布号 JPS6418278(A) 申请公布日期 1989.01.23
申请号 JP19870175216 申请日期 1987.07.14
申请人 SHARP CORP 发明人 FUJII YOSHIHISA;SHIGETA MITSUHIRO;FURUKAWA MASAKI;NAKANISHI KENJI;UEMOTO ATSUKO
分类号 H01L31/108;H01L31/0248;H01L31/0312;H01L31/113;H01L31/20 主分类号 H01L31/108
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