| 摘要 |
<p>PURPOSE:To enhance the bonding strength and the thermal resistance by a method wherein an alloy layer is formed on a bonding face between a ceramic substrate and a metal pin. CONSTITUTION:A brazing material 6 is pasted to a metal film 2; then, the pasted brazing material 6 is brought into contact with a lower end of a metal pin 3 which has been erected in its axial direction; an electric current is applied to a contacted joint part; this part is heated; the brazing material 6 is melted; the metal pin 3 is pressurized; the joint part is bonded. An alloy layer 9 formed together with the brazing material 6 is formed on the metal film 2; the alloy layer 9 formed together with the brazing material 6 is formed on the metal pin 3; these individual alloy layers 9 are heated and pressurized; the brazing material 6 whose melting point is lower is squeezed; a bonding operation is executed. While the bonding operation is executed at a temperature which is lower than that of a conventional operation, the alloy layer 9 whose remelting point is higher than a melting point of the brazing material 6 remains at a bonding face between the metal pin 3 and the metal film 2. By this setup, the bonding strength and the thermal resistance are enhanced.</p> |
