| 摘要 |
<p>PURPOSE:To prevent the damage to a protective film on the surface of LSI chip and a surface layer as well as the short-circuit between leads and semiconductor chip ends from occurring by a method wherein auxiliary bumps such as short-circuit preventive auxiliary bumps, etc., are arranged outside connecting bumps on a semiconductor chip. CONSTITUTION:Connecting bumps 2 for power supply and input output signals are arranged zigzag on the four side peripheral parts on the surface of an LSI chip 1 while auxiliary bumps 3 and short-circuit preventive auxiliary bumps 4 are provided outside those connecting bumps 2. Then, the damage to a protective film 5 on the surface of LSI chip from leads 6 due to the pressure of bonding tool during bonding process as well as the cracking of the surface layer of LSI chip can be prevented from occurring. Furthermore, the short-circuit between leads and the ends of LSI chip due to the deformation of leads 6 during bonding process and later operational processes can be prevented from occurring.</p> |
