| 摘要 |
PURPOSE:To inhibit the dimensional change and the variability during the manufacturing process of an internal layer substrate by a method wherein a metal foil for reinforcement is buried in the processing bed area outside the product pattern area of the internal layer substrate. CONSTITUTION:Copper foils 1 of a thickness of 35mum and a size of 500mm square are each arranged on the outerest sides of the surface and the rear of an internal layer substrate 4, glass cloth-polyimide resin prepregs 2 of a thickness of 0.05mm and, a size of 500mm square are each arranged on the inner sides, a picture frame-shaped copper foil of a thickness of 50mum and a width of 50mm is inserted in the center as a metal foil 3 processed in the form of a picture frame, the whole is laminatedly formed and the laminated material is used as the 35-mum copper-clad internal layer substrate 4, which consists of an insulating layer of a thickness of 0.1mm and has a size of 500mm square. The area outside one dotted chain lines is a processing bed area 6, the picture frame-shaped copper foil of a thickness of 50mum is buried in the area 6 and the area within the one dotted chain lines becomes the internal layer substrate for a glass cloth-polyimide resin laminated plate as a product pattern area 5. After an internal layer pattern is formed, a prepreg layer and an external layer substrate are laminated on the internal layer substrate and the internal layer substrate is integrally formed with the prepreg layer and the external layer substrate to become a substrate formed in a multilayer. After that, the connection of an internal layer, perforations of penetrating holes for component leads, the formation of through holes and the formation of an external layer pattern are performed to obtain a multilayer printed-wiring board. |
