| 摘要 |
PURPOSE:To keep insulation between an electrode plate and a heat sink excellently, by providing a positioning hole in the electrode plate, which is bonded to the insulating plate on the heat sink beforehand, and providing a projection, which is coupled into said hole, in the heat sink. CONSTITUTION:An electrode plate 1 and a semiconductor chip 4 are bonded to an insulating plate 1 on a heat sink 2. A projection 12 is coupled into a hole 11. Thus the electrode plate 3 is positioned at the specified bonding position with respect to the insulating plate 3. After the electrode plate 3 is bent upward, the plate and a semiconductor chip 4 are connected with a wire 5. The semiconductor chip 4 and the like in a case 6 are packaged with silicon gel 7 and epoxy resin 8. Since the positioning hole 11 is provided in the electrode plate 3, which is bonded to the insulating plate 1 on the heat sink 2 and the projection 12, which is coupled into the hole, is provided; the bonding position is determined as specified when the electrode plate is bonded to the insulating plate, and the insulation between the electrode plate and the heat sink is kept excellently. |
