| 发明名称 |
METHOD OF BONDING COPPER AND RESIN |
| 摘要 |
A method of bonding copper and a resin together is disclosed which comprises forming a copper oxide layer on the surface of copper to be bonded to a resin, reducing the copper oxide layer to metallic copper with a reducing solution, and bonding the metallic copper and the resin together. According to this method, a good acid resistance of the bonding interface and a sufficiently high bonding strength can be obtained. |
| 申请公布号 |
DE3661427(D1) |
申请公布日期 |
1989.01.19 |
| 申请号 |
DE19863661427 |
申请日期 |
1986.01.29 |
| 申请人 |
HITACHI, LTD. |
发明人 |
AKAHOSHI, HARUO;MURAKAMI, KANJI;WAJIMA, MOTOYO;FURUKAWA, KIYONORI;TOBA, RITSUJI;SHIMAZAKI, TAKESHI |
| 分类号 |
B32B15/08;B32B15/088;B32B15/092;C08J5/12;C23C18/40;C23C22/05;C23C22/63;C23C22/83;H05K3/38;H05K3/42;H05K3/46;(IPC1-7):C23C18/38;C23C16/40;C23C16/56;B32B15/20;B32B31/20 |
主分类号 |
B32B15/08 |
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