| 摘要 |
<p>PURPOSE: To prevent a film piece from being brought in a mounted integrated circuit device by separating the film piece from leads for interconnection by heating the film piece after or during a process for bonding the leads to an integrated circuit, lead frame, or wiring board. CONSTITUTION: Leads 2 for interconnection are bonded to the surface 11 of a film piece 1 at the boundaries between the leads 2 and film piece 1. In addition, the leads 2 are fixed to a lead frame 13 for interconnection by forming reflow solder junctions 17 by using a heater block 12. In this case, it is preferable to make the block 12 supply heat required for deteriorating a polyester adhesive at the boundaries 10. When the heat is supplied to the adhesive, the adhesive is deteriorated and loses its bonding strength. Therefore, the film piece 1 can be easily removed from the leads 2.</p> |
