| 摘要 |
PURPOSE:To form a thin plating layer by forming the plating layer on the inside surface of a cylindrical mold and stripping the layer thereby forming a seamless belt. CONSTITUTION:The conductive seamless layer 1 is formed on the inside surface of the cylindrical mold 3 and thereafter a lining layer 2 is formed on the inside thereof. After the seamless layer 1 is stripped from the mold 3, a photosensitive body layer 5 is worked on the belt surface and members 6 for stopping biasing are worked on the inside ends by which the photosensitive belt 4 is constituted. Since the plating layer 1 can be thereby formed extremely thin, the time is shortened. The lining layer can be further formed on the inside surface while the belt is held put in the mold and, therefore, the handling is facilitated. |
