发明名称 |
Tape carrier for semiconductor chips. |
摘要 |
<p>A tape carrier (1) for semiconductor chips (4) including an insulating tape; a plurality of first conductor patterns (3) longitudinally formed on the tape and spaced from each other each of the first conductor patterns having first leads connected with substrate electrodes of a semiconductor chip and second leads connected with the other electrodes of the chip; a second conductor (5) shaped like a stripe and disposed near each of the first conductor patterns on the tape; and a third conductor pattern (6) formed on the tape and having conductors electrically connecting the first leads with the second conductor pattern.</p> |
申请公布号 |
EP0299768(A2) |
申请公布日期 |
1989.01.18 |
申请号 |
EP19880306454 |
申请日期 |
1988.07.14 |
申请人 |
SHARP KABUSHIKI KAISHA |
发明人 |
TAJIMA, NAOYUKI;CHIKAWA, YASUNORI;TSUDA, TAKAAKI |
分类号 |
H01L23/495;H05K1/02 |
主分类号 |
H01L23/495 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|