| 摘要 |
PURPOSE:To reduce the inductance of a lead and to enhance the moistureproofness by a structure wherein a part where a semiconductor chip is mounted and a tip part of the lead are exposed on an upper face of a resin substrate, an inner lead pierces the resin substrate and an external lead is exposed amd extended on a bottom face of the resin substrate. CONSTITUTION:The shape of a lead which is guided from a tip part 12a of the lead and a die pad 12e to and external extraction part 12b is formed in such a way that its height is equal to that from the surface to a bottom face of a resin substrate 11. Then, a semiconductor chip 13 is wire-bonded by using a thin metal wire 14 connecting an electrode of the die pad and the tip part of the lead. The lead where the semiconductor chip is mounted is resin-molded by using a metal mold. For this process, the size of the lead is designed in such a way that the semiconductor chip and the wire-bonded part are exposed on the surface of the resin substrate and that an external lead is exposed on the bottom face of the resin substrate. Furthermore, in order to protect the semiconductor chip and the thin metal wire which are exposed on the surface of the resin substrate, a cap 16 having a hollow part 17 is glued by using an adhesive agent 15. It is preferable to form a reservoir 18 for the adhesive agent at a cap-sealing part in order to enhance the moistureproofness and to secure the glueing strength. |
