| 摘要 |
PURPOSE:To prevent temperature of electronic components on a printed substrate and its rear face from rising by externally discharging air after blown from a plurality of cold air supply passages for passing cold air and a supply passage to the rear face of the substrate and thermally exchanged. CONSTITUTION:A printed substrate 3 is transferred onto a conveyor 2 from the upstream of a curing furnace body 1, and moved toward the downstream side. Adhesive for bonding electronic components 8 on the upper face of the substrate 3 is cured and/or soldered by a heater 7. Simultaneously, the rear face of the substrate 3 can be cooled by a cooler 9. That is, the atmospheric air is introduced by an air supply fan 16 to be blown through an air supply tube 17 and cold air supply ducts 14 to the rear face of the substrate 3 so as not to be heated to higher than required. Then, the air is thermally exchanged with the substrate 3 and the components 8 to be raised at its temperature, and then exhausted by an exhaust fan 19 through exhaust ducts 15 and exhaust tubes 20 out of the body 1. |
