SOLDER SUPPLYING METHOD FOR ELECTRONIC PART

摘要

PURPOSE:To supply the proper quantity of solder to electrodes of the titled electronic part by the simple stage by spraying solder balls with the proper size in a state with a solder film layer molted by a dip method. CONSTITUTION:The electronic part 1 having connected electrodes 2 is immersed in a solder tank 8 in which the molten solder 5 is contained to from the solder film layer 3. Next, the electronic part 1 is heated by a heating machine 6 and the solder film layer 3 is maintained in the molten state and further, the solder balls 4 with the proper size are sprayed on the solder film layer 3 in the molten state by a solder spraying machine 7 and stuck to the solder film layer 3. By this method, the proper quantity of solder can be supplied inexpensively to the connected electrode part of the electronic part having the fine connected electrodes by the simple stage.