发明名称 MANUFACTURE OF CIRCUIT BOARD
摘要 PURPOSE:To form uniform through holes of products with less manufacturing steps and cost by dipping the ends of pins in conductive resin paint, inserting them into the through holes of a circuit board, reciprocating them plural times, removing the pins, and then curing the paint in the holes. CONSTITUTION:When a pin 1 formed with a spiral groove 1a is dipped in conductive resin paint 2 mixed with silver particles and pulled up, the paint 2 is adhered to the end. However, since excessive paint 2 is adhered, the pin 1 is inserted into the hole 3a of a dummy board 3 formed of the same array as that of the through holes of the board so as to provide necessary sufficient amount of the paint. When the pin 1 is then pulled up, the excessive paint is removed. The pin 1 is inserted to the hole 4a of the board 4, reciprocated several times in the hole 4a to drape the paint 2 with the inner wall of the hole 4 so as to uniformly adhere the paint to the whole periphery. When the pin 1 is pulled up, a snow hole 7 for conducting conductor patterns 5, 6 on the front and rear face of the substrate 4 is formed with the paint 2 in the hole 4a.
申请公布号 JPS6411397(A) 申请公布日期 1989.01.13
申请号 JP19870167488 申请日期 1987.07.03
申请人 HOKURIKU DENKI KOGYO KK 发明人 IDA KIYOSHI;SAKURAI SHIZUO;SHINKAWA SAKAE;OBARA YOZO
分类号 H05K3/40;H05K3/42 主分类号 H05K3/40
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