| 摘要 |
<p>PURPOSE:To eliminate misregistration which takes place in the case of separating a semiconductor wafer from a positioning jig even in the case where chemicals adhere to the positioning jig by fixing the semiconductor wafer which is braked by the positioning jig directly at the underside of the wafer and during its fixing by separating its positioning jig from the semiconductor wafer. CONSTITUTION:A positioning jig 7 brakes a semiconductor wafer 2 which is conveyed by rotating belts to a stop. This device allows a vacuum sucking plate 8 to rise directly from the under-side of the semiconductor wafer 2 and its wafer is fixed under vacuum suction. Then an air cylinder 9 makes the positioning jig 7 move to separate its jig from the wafer 2. Finally, the vacuum break of the vacuum sucking plate 8 lowers its plate so as to separate its plate 8 from the semiconductor wafer 2. Since chemicals do not adhere to the wafer when its wafer is conveyed from the rotating belts to a drying plate, positioning is performed without making the semiconductor wafer deviate from the required position.</p> |
