| 摘要 |
PURPOSE:To offer a method of taking out a lead of a semiconductor chip component whose process is simple, whose cost is low and whose reliabilily is high by a method wherein the semiconductor chip component where a pad part bas been formed is installed inside a through hole made in a substrate, an insulating resin is filled between the component and peripharal walls to make the surface of one side of the substrate and the surface of the pad part flat and, furthermore, a conductive paste is coated to form a conductive part which is connected electrically to the pad part. CONSTITUTION:A through hole 8 is made in a substrate 1; an adhesive tape 9 is applied to the surface 1U; an opening on the side of the surface is closed; the surface and the rear are inverted so that the side of the rear 1D becomes an upper side. A MOSFET 2 is set inside the through hole 8 in such a way that the surface of pad parts 2A, 2A comes into contact with the adhesive tape 9; an insulating resin 10 is filled between sidewalls and the MOSFET 2 without leaving a gap. The adhesive tape 9 is stripped off and the substrate 1 is turned over so that the surface 1U becomes the upper face; the pad parts 2A, 2A are situated on the same plane as the surface 1U of the substrate 1. A conductive paste is applied to the surface 1U by a screen printing method; conductive parts 4, 7, 5, 6 and the like which are connected electrically to the pad parts 2A, 2A are formed; they are heated and hardened; after that, a passivating part 11 is formed; an operation to mount the MOSFET 2 on the substrate 1, another operation to take out its lead and one more operation to form the electrodes 3, 4, 5, 6, 7 are executed with one process. |
