| 摘要 |
PURPOSE:To manufacture an insulating plate with a metal layer without pinhole even if it is thin by forming a thin nickel layer on the uneven face of a metal foil support having the uneven face, laminating the thin layer with an insulating organic material to be integrated, and then selectively removing the support by etching. CONSTITUTION:A nickel layer formed by electroless nickel plating or the like on a metal foil support, such as a copper foil or the like having an uneven face is formed in a uniform thickness along the rough shape of the copper foil surface. Thus, after the copper foil formed with the nickel layer and resin are laminated, a thin nickel layer is transferred simultaneously with the uneven shape of the support to a substrate surface on which only the copper is removed by etching. The electroless plating provides less irregularity in the thickness of plating film according to the place, and scarcely generates a pinhole. Accordingly, the laminated plate with extrathin metal foil smaller than 5mum in thickness can be manufactured. |
