发明名称 SEMICONDUCTOR LEAD FRAME
摘要 PURPOSE:To prevent a large loop bend from occurring by bending the inner edges of lead terminals in a circular-arc shape, and forming recesses at positions where a pair of linear lines for connecting the fine metallic wire connecting positions of the terminals to the corners of an element placing unit disposed on the outermost side cross the inner edges. CONSTITUTION:An inner edge 16 is formed in a circular-arc shape having a diameter of the same as or larger than the lateral size W of a stitch lead 13. A plurality of fine recesses 22, ... of V shape are formed over its whole length between the edges 16 of the lead 13 and a crossing point on an edge line cross ing at its upper face 21. The number and forming positions of the recesses are not limited, but may be formed at least at crossing point positions, or may be formed along the thicknesswise direction of the edge 16. Since the recesses 22 are formed over the outermost side of a range capable of getting into contact with fine metallic wirings 15, i,e., the whole length between the crossing points, even if the wirings tends to slide laterally, its movement is obstructed by the recesses to suppress movement.
申请公布号 JPS648651(A) 申请公布日期 1989.01.12
申请号 JP19870164356 申请日期 1987.06.30
申请人 MITSUBISHI ELECTRIC CORP 发明人 YONEMURA TOSHIO
分类号 H01L23/50;H01L21/52;H01L21/60 主分类号 H01L23/50
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