| 摘要 |
PURPOSE:To reduce the time for measuring dissolution characteristic of resist by simplifying a jig for attaching a substrate coated with the resist. CONSTITUTION:A substrate 7 coated with a resist film 6 is placed on the upper surface near the center of a jig 8 provided with a light transmitting part, and a developing soln. is dropped on the film 6. The development of the film 6 is begun immediately after dropping the soln., and the film 6 is dissolved in the soln. and the film thickness becomes thinner slowly. On one hand, the film 6 is irradiated with laser light from a source 13 of the laser light simultaneously with the dropping of the soln. from the rear side of the substrate 7. The intensity of reflected light is sensed with a photodetector 9, thus dissolution characteristic of the resist in the developing soln. is measured. The development may be executed by dropping the soln. after exposing the film 6 to a desired degree of exposure by irradiating the film 6 by opening or closing a shutter 2 to control the light from the light source 1. |
