| 摘要 |
PURPOSE:To utilize a computer output for the manufacture of a printed circuit board as it is and to simplify manufacturing steps by transferring a conductive path pattern to an insulating substrate by a thermal transfer printing method using a thermal transfer material made of semicured thermoset synthetic resin containing fine conductive particles. CONSTITUTION:A thermal transfer sheet 1 is formed, for example, of a layer of a thermal transfer material 12 in which a base material 11 of a plastic film, such as polyethylene terephthalate resin is coated with semicured thermoset synthetic resin including fine conductive particles. Then, a thermal head 4 is heated to a predetermined heating point in response to a signal from an exterior controlled by a computer, the predetermined part of the material 12 of semicured state on the sheet 1 is melted by the heat, and transferred onto a transfer medium 2. |
