| 摘要 |
PURPOSE:To increase the exposed area of a heat-dissipating board as well as to reduce the thermal resistance of a semiconductor device when a heat sink is attached by a method wherein a semiconductor pellet is fixed to the heat dissipating board having a lead-out wire terminal, and the lead-out wire is led out from the recess formed on one side face part of the heat-dissipating board. CONSTITUTION:The lead terminal 5 of a heat-dissipating board 1, on which a semiconductor pellet 6 is adhered, is led out laterally from the lead outlet part 4 of a recess 3 which is formed by notching toward the inside of a part of one side face of the heat-dissipating board 1, it is bent upward, then bent in horizontal direction, and it is led out to the outside of sealed resin 7 in the state as it is. As the lead terminal is led out from the point a little toward inside from the side face of the heat-dissipating board as above-mentioned, the distance from the led out point to the outside of the resin can be made larger. Accordingly, the lead terminal can be fixed completely by the resin, and it can endure sufficiently for the stress of a tensile test. |
