| 摘要 |
<p>This invention relates to a resin composition composed of (A) 70 to 99 % by weight of a polyether imide, and (B) 30 to 1 % by weight of an ethylene copolymer comprised of 50 to 90 % by weight of ethylene, 5 to 49 % by weight of an alkyl ester of an α, β-unsaturated carboxylic acid, and 0.5 to 10 % by weight of maleic anhydride. The resin composition of the present invention has remarkably reduced fragility while maintaining the heat resistance and rigidity characteristic of a polyether imide resin itself and is useful as engineering plastics for applications, such as electrical and electronic components, automobile parts, and parts of offfice automation appliances, where reduction in thickness and size are required.</p> |
