| 摘要 |
PURPOSE:To reduce the deviation of an optical axis and to improve manufacturing yield by interposing a solder ring between a stem to which a light emitting element pellet is secured and a cap to which a ball lens or a rod lens is secured, malting the ring by high frequency heating, and sealing the stem and the cap. CONSTITUTION:A solder ring 2 is interposed between a cap 1 with a ball ring 4 and a step 3 to which a light emitting element 5 is secured, and optical axes of the pellet 5 and the lens 4 are regulated. Then, the ring 2 is melted by high frequency heating on the outer peripheries of the cap 1 and the step 2 in this state and sealed. As a result, an optical semiconductor device in which the deviation of the optical axis is reduced and manufacturing yield is improved is obtained. |
