发明名称 MANUFACTURE OF THROUGH-HOLE PRINTED CIRCUIT BOARD
摘要 PURPOSE:To manufacture a high performance through-hole-plated circuit board without producing any bad product while preventing a coating material from being subjected to bad electrolytic deposition onto a board surface, the inside of the through-holes, and edges by processing a substrate, both surfaces of which are previously overlaied with copper, with a soft etching solution, prior to the formation of a wiring pattern by electrolytic deposition coating. CONSTITUTION:A substrate, both surface of which are previously overlaid with copper, made electrically conductive by a copper-plated layer formed in a through-hole is processed with a soft etching solution, prior to the formation of a wiring pattern by electrolytic deposition coating. The soft etching solution may include preferably a solution of peroxodisulfate, a mixed solution of mineral acid and an oxidizing agent, and a mineral acid solution or an organic carboxylic acid solution. For example, a copper-plated layer is formed on the inside wall of the through-hole and on the copper-overlaid layers formed on both surface of the substrate, which is then printed with etching resist ink to from a glass epoxy plate, on both surfaces of which plate copper is overlaid, including thereon a reverse pattern resist coated layer. The glass epoxy plate is then degreased and dipped in a 15% aqueous solution of sodium perxodisulphate for to minutes. The resulting substrate is, after rendered to washing and dewatering, dipped into an electrolytic deposition coating for electrolytic deposition coating to from an electrolytic deposition coated resin film on the copper-plated layer.
申请公布号 JPS647690(A) 申请公布日期 1989.01.11
申请号 JP19870162985 申请日期 1987.06.30
申请人 UBE IND LTD;MEIKO DENSHI KOGYO KK 发明人 YASUNO HIROSHI;SAKATANI SHIRO;KANDA TAKESHI
分类号 H05K3/42;H05K3/06 主分类号 H05K3/42
代理机构 代理人
主权项
地址