| 摘要 |
PURPOSE:To prevent the increase in a circuit-resistance value in cases where a replication sheet is transferred into a molding by transferring the replication sheet having a printed circuit which is formed using specific conductive ink into a plastic molding on a substrate sheet at high temperatures and pressures. CONSTITUTION:A replication sheet having a printed circuit which is formed using conductive ink where its vehicle has a principal composition consisting of a thermoplastic resin having low softening temperature and melt viscosity is transferred to a plastic molding on a substrate sheet at high temperature and pressures. That is, vehicle of conductive ink becomes soft at a high temperature and its low viscosity makes conductive particles contained in its ink move easily. As the conductive particles do not have spherical form in general and have a relatively slender form (namely, they exhibit conductivity by coming into contact with each other), they are orientated along the surface of the molding by being oppressed at a high pressure and their resistance along an orientated surface becomes low. Such a state of the orientated surface prevents the increase in a circuit-pressure value in cases where the replication sheet manufactured by printing is transferred into the molding. |
