发明名称 SEMICONDUCTOR DEVICE AND MOUNTING THEREOF
摘要 <p>PURPOSE:To prevent outer leads form deforming by a method wherein a lead holding part comprising inner lead holding frames and outer lead holding frames is formed on a film tape furthermore guide holes are formed. CONSTITUTION:Guide holes 24 are formed on the parts near four corner parts of a film tape 21. Besides, multiple leads 25 comprising copper foils etc., are formed in four directions on the film tape 21 while the parts near the ends of inner lead parts 25-1 of the leads 25 are connected to a semiconductor elements 26 contained in an opening part 22. Furthermore, the inner leads 25-1 are mutually linked and held with one another by inner lead holding frames 23-1 around the opening 22. On the other hand, the parts near the ends of outer leads 25-2 are linked and held with one another by outer lead holding frames 23-2. In such manner, the outer leads 25-2 vulnerable to deformation can be surely prevented from deforming.</p>
申请公布号 JPS647529(A) 申请公布日期 1989.01.11
申请号 JP19870161882 申请日期 1987.06.29
申请人 OKI ELECTRIC IND CO LTD 发明人 OKUAKI YUTAKA
分类号 H01L21/60 主分类号 H01L21/60
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