| 摘要 |
PURPOSE:To make it possible to heat ICs to a specified temperature in a short time, by providing a heating unit having air blowing parts, which are provided directly over integrated circuits mounted on IC sockets. CONSTITUTION:A stage 6 is attached on a test board 1. A heating unit 5 is mounted on the stage 6 and coupled with a hinge 7. The unit 5 can be opened with the stage 6 as a supporting point. At the lower surface of the unit 5, air blowing ports 4 are provided directly over ICs 3, which are mounted on IC sockets 2. The IC sockets 2 are attached on the test board 1 and wired. An air supplying hose 8 is connected to the side surface of the heating unit 5 and supplies heated air to the air blowing ports 4. The air from the hose 8 enters into the heating unit 5. The air is blown to the ICs 3 so as to heat the ICs. Since the unit 5 can be turned in the direction of an arrow B, the replacing work of the ICs 3 can be readily performed. |
