发明名称 MANUFACTURE OF HEAT RESISTANT POSITIVE TYPE RESIST AND HEAT RESISTANT RELIEF CONSTRUCTION
摘要 PURPOSE: To obtain a characteristic spectrum showing resistance against high temp., and especially to obtain high solubility by using a specified hydroxy polyamide as a polybenzo oxazole precursor. CONSTITUTION: A hydroxy polyamide expressed by formula I is used as a polybenzo oxazole precursor. In formula I, R, R*, R1 , R1 * are aromatic groups, n1 , n2 are 1 to 100, R1≠R1 and/or R1≠R1 *. This hydroxy polyamide is a polycondensation product produced from an aromatic diamino dihydroxy compd. and an aromatic dicarboxylic acid or dicarboxylic acid chloride, and more particularly, it is a co-condensation product. Thereby, a positive resist having heat resistance or resistance against high temp. and excellent solubility can be obtd.
申请公布号 JPS646947(A) 申请公布日期 1989.01.11
申请号 JP19880118030 申请日期 1988.05.13
申请人 SIEMENS AG 发明人 HERUMUUTO AANE;ARUBERUTO HANMAASHIYUMITSUTO
分类号 C08G69/26;C08G69/00;C08G69/42;C08G73/22;C08K5/23;C08L79/04;G03C1/00;G03C1/72;G03F7/022;G03F7/023;G03F7/039;H01L21/027 主分类号 C08G69/26
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