发明名称 BONDING EQUIPMENT FOR MANUFACTURE OF SEMICONDUCTOR PARTS
摘要 PURPOSE:To operate and manage a bonding equipment, by connecting an IC card containing an IC memory to a control equipment via an IC card connecting part, and performing input and output of data between the IC memory and the control equipment. CONSTITUTION:An IC card 32 containing a RAM 33 is connected to a main control equipment 23 via a read-write equipment 30. Between the RAN 33 of the card 32 and the equipment 23, input and output of data are performed. A CPU 27 of the equipment 23 drives and controls each motor 16, 17, 18 via an XYZ controlling part 24 in the manner in which a bonding tool operates according to a pattern stored on the card 32. The CPU 27 drives and controls a feeder motor 22 via a feeder controlling part 25 in the manner in which a feeder operates with a pitch stored on the card 32 and a specified timing. Thereby, a bonding equipment is operated and managed.
申请公布号 JPS645021(A) 申请公布日期 1989.01.10
申请号 JP19870159819 申请日期 1987.06.29
申请人 TOSHIBA SEIKI KK 发明人 SHIMADA SHUICHI
分类号 H01L21/52;B42D15/02;B42D15/10;H01L21/02;H01L21/60 主分类号 H01L21/52
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